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HOME > Product > Chemical Polishing > CPI600 > CPI600 Pure Chemical Polishing Machine

CPI600 Pure Chemical Polishing Machine

CPI series pure chemical polishing equipment is made of strong corrosion resistant materials, suitable for corrosion polishing solvents such as bromine methanol, hydrogen peroxide or acid etching solvent. It can achieve no scratch, no orange peel effect of high quality surface polishing.


 

  • Functional Feature Description
  • Technical Application
  • Equipment Parameter
    • • Almost zero mechanical force, to achieve no scratches, no orange peel effect of high quality surface polishing.
      • Super anti-corrosion material, made of polypropylene, PVDF coated and epoxy polyurethane, can be applied to a variety of corrosive solution, such as bromine methanol, etc.
      • The jig can be selected with counterweight blocks of different weights, that suitable for polishing process requirements of different materials.

       
    • • Processing sample size (2×6 "), (3×4 "), (2×3 "and 1×4"), (1×3 "and 2×4"), (3×3 "and 3×4") and other size combinations can be customized according to user process requirements.
      • Drip speed, lapping speed can be set, plate speed is 0-120rpm, it is easy to operate and can remote control.
      • The switch of treadling type, can control the equipment remotely, avoid injury to operators from corrosive solutions.
    • • The time from 0 to 10 hours can free adjusted, when reach the set time, the device can be set to continue running, and also be set to stop automatically.
      • This machine has high precision corrosion polishing of semiconductor wafers and optical crystals, and provides solutions for minimum crystal stress.
    • • Used for infrared detection and other devices of CZT, MCT, InSb, GaSb, etc. 
      • Used for thin and brittle semiconductor materials, such as GaAs, InP and a variety of Ⅲ-Ⅴ,Ⅱ-Ⅵ compounds, etc.
      • Used for all high standard applications of requiring electronic or optical grade polishing, such as CdS and similar photoelectric materials.
    • The scope of application includes:
      • MEMS
      • Semiconductor devices
      • Semiconductor substrate
      • Encapsulation
    Project Parameter
    Power supply: 220-240v 10A
    110v 10A
    50-60HZ
    Ambient temperature: 20℃±5℃
    Ambient humidity: < 80%
    Wafer size: ≤150mm
    Working plate diameter: 355mm/406mm/508mm
    Plate speed: 0-120rpm
    Timing: 0-10 hours
    Feed channel: ≥2

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