Email Address：
info@mcfsens.com
info@mcfsens.com
400-6988-696
Multiple consumable warehouses around the world, rapid delivery, centralized order time to greatly save costs
MCF has a wide variety of colloidal silica, which can provide conventional colloidal silica polishing fluid according to different materials and process requirements of users, and can also provide professional chemical polishing fluid for special materials requiring.
MCF wax remover is extracted from plants, which is more environmentally friendly, non-toxic and harmless to human body. It is an efficient wax removal cleaning product. It has the characteristics of fast and thorough wax removal and good water washing performance.
MCF bonding wax is mainly divided into low temperature bonding wax and high temperature bonding wax, with stable quality, no impurities, high bonding precision, good fixing effect, uniform waxing, easy cleaning, high temperature bonding wax viscosity, strong bonding.
MCF wax-free adhesive film is suitable for fixing samples of semiconductor materials and photoelectric materials before polishing. Such as: silicon wafer, sapphire, ceramic wafer, GaAs, InP, CZT, MCT and other conventional samples or special-shaped sample materials with high precision grinding, polishing and other processes.
MCF float glass substrates are manufactured from high quality, optical grade fused silica. The substrate is 3 inch TTV less than or equal to 1μm, 4 inch TTV less than or equal to 2μm, 6 inch TTV less than or equal to 3μm.
MCF grinding powder/polishing powder include: alumina powder, silicon carbide powder, boron carbide powder, cerium oxide powder and so on. The grinding liquid/polishing liquid can be proportioned according to the requirements of the user's material and process, or it can be adjusted according to the process requirements and materials by itself.
MCF diamond slurry mainly consists of single crystal diamond slurry and polycrystal diamond slurry through high precision matching, which is mainly used in semiconductor industry and photoelectric industry. According to different process requirements, single crystal diamond slurry or polycrystal diamond slurry with different particle size and ratio is selected.
MCF precision grinding polishing pad, it is good abrasive storage, economic and durable, different materials, different particle sizes, mainly suitable for semiconductor industry and photoelectric industry precision grinding polishing processing. The high accuracy below nanometer level is excellent.
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