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info@mcfsens.com
info@mcfsens.com
400-6988-696
The MP series polishing machine is an ideal grinding and polishing system for various material chips (SiC GaN、AlN、Sapphire…)、 Large batch grinding and polishing processes for components, such as filtering materials, wedge materials, and LCD display panels.
GNAD-E series is a precision polishing equipment covering semiconductor materials, photoelectric materials and other applications. The whole equipment has anti-corrosion, scientific design, advanced performance, high degree of automation, easy operation, reliability and strong maintenance.
GNAD-T series is a precision polishing equipment covering semiconductor materials, photoelectric materials and other applications. The equipment has high degree of automation and easy operation. It is an ideal lapping equipment for scientific research and production experiments.
GNAD-P Series series is suitable for lapping and thinning of various semiconductor wafers, and chemical mechanical polishing of bottom, surface and end face. And can be customized according to the user process requirements of various angle accessories and other non-standard jig accessories, to achieve the non-standard shape sample and angle polishing.
GNAD Custom series is a precision polishing equipment covering semiconductor materials, photoelectric materials and other applications. The equipment has high degree of automation and easy operation. It is an ideal lapping equipment for scientific research and production experiments.
CPI series pure chemical polishing equipment is made of strong corrosion resistant materials, suitable for corrosion polishing solvents such as bromine methanol, hydrogen peroxide or acid etching solvent. It can achieve no scratch, no orange peel effect of high quality surface polishing.
CPI series pure chemical polishing equipment is made of strong corrosion resistant materials, suitable for corrosion polishing solvents such as bromine methanol, hydrogen peroxide or acid etching solvent. It can achieve no scratch, no orange peel effect of high quality surface polishing.
Precision CMP equipment achieves efficient removal of excess material from wafer surfaces and global nanoscale flattening through the synergistic action of chemical etching and mechanical lapping.
Precision CMP equipment achieves efficient removal of excess material from wafer surfaces and global nanoscale flattening through the synergistic action of chemical etching and mechanical lapping.
Precision CMP equipment achieves efficient removal of excess material from wafer surfaces and global nanoscale flattening through the synergistic action of chemical etching and mechanical lapping.
Precision CMP equipment achieves efficient removal of excess material from wafer surfaces and global nanoscale flattening through the synergistic action of chemical etching and mechanical lapping.
Precision CMP equipment achieves efficient removal of excess material from wafer surfaces and global nanoscale flattening through the synergistic action of chemical etching and mechanical lapping.
The AMS series of wafer substrate bonding equipment is developed by MCF Company for high-precision semiconductor wafer sample and float glass substrate bonding process, complete automatic bonding operation, equipped with vacuum and pressure bonding units. Easy to operate, high quality to achieve bonding process.
AMS-400S series semi-automatic adhesive machine is a tool developed by MCF company for high precision semiconductor wafer sample wafer and substrate wafer bonding process, equipped with pressure bonding module. Easy to operate, high quality to achieve bonding process.
The AMS series of wafer substrate bonding equipment is developed by MCF Company for high-precision semiconductor wafer sample and float glass substrate bonding process, complete automatic bonding operation, equipped with vacuum and pressure bonding units. Easy to operate, high quality to achieve bonding process.
The AWS series of wafer substrate bonding equipment is developed by MCF Company for high-precision semiconductor wafer sample and float glass substrate bonding process, complete automatic bonding operation, equipped with vacuum and pressure bonding units. Easy to operate, high quality to achieve bonding process.
The MCF precision jig is suitable for lapping and polishing semiconductor and photovoltaic materials. The jig is made of high strength corrosion resistant material and is suitable for use with chemical polishing fluid.
MCF precision jig is suitable for lapping and polishing of semiconductor materials and photoelectric materials. The jig adopts high-strength corrosion-resistant materials, automatic connection of Bluetooth transmission and real-time online monitoring.
MCF precision jig is suitable for lapping and polishing of semiconductor materials and photoelectric materials. The jig is made of high-strength corrosion-resistant material, which can be used for chemical polishing liquid.
MCF precision jig is suitable for lapping and polishing of semiconductor materials and photoelectric materials. The jig is made of high-strength corrosion-resistant material, which is suitable for polishing optical fiber end face or crystal end face.
With contact measurement, measurement accuracy of 1 micron can be achieved, and the instrument is easy to operate and stable. Suitable for use in a variety of environments, the base is acid and alkali resistant and is a commonly used measuring instrument for semiconductors, optical and photoelectric materials etc.
The loading gauge can accurately measure the pressure value of the wafer back. It is suitable for SH series jig. It helps the operator to accurately set the sample load and achieve high quality lapping and polishing effect.
The " cushion of air " type non-contact measurement can avoid the surface damage caused by contact measurement. It is especially suitable for the measurement of soft and brittle materials and samples with high surface quality requirements. It is an ideal measuring instrument for semiconductor, optical and photoelectric materials.
The flatness tester has digital display and is easy to operate. Ensure process repeatability and consistency, applicable to the entire range of products. Helps operators to accurately set equipment parameters and achieve high-quality grinding and polishing effects.
MS1000 is easy to operate, with complete measurement functions, covering nanoscale micro profiles, two-dimensional dimensions, and spectral analysis. It has strong versatility and high accuracy, helping our customers stay at the forefront of precision manufacturing and material research and development.
Micro2000 multi-mode 3D microscope is a detection instrument used for measuring nanoscale roughness of various precision devices and material surfaces, especially suitable for measuring the three-dimensional microstructure of samples with a maximum size of 300mm.
MCF half circle roller arm is suitable for our precision lapping and polishing equipment sample processing, according to the user sample processing requirements to choose high-speed or low-speed drive system, but also according to the users to customize the equipment in line with the custom PM5, PM6, LP70 and other equipment.
MCF cast iron lapping plate is mainly made of iron and composite metals and are suitable for use with our precision lapping equipment, while to provide users with relevant custom lapping plate about PM5, PM6, LP70 and other equipment.
MCF cast iron testing blocks are mainly made of iron and composite metal, which are used in conjunction with our cast iron lapping plate, and we can also provide custom cast iron testing blocks for PM5, PM6 and LP70 machines users.
MCF glass testing blocks are mainly made of quartz glass and composite metal and are used in conjunction with our glass lapping plate, while custom glass testing blocks are available for PM5, PM6 and LP70 machines users.
The MCF abrasive autofeed cylinder is made of a composite anti-corrosion material with good sealing properties and high corrosion resistance and is suitable for highly corrosive liquids such as aluminium oxide abrasives, silicon carbide abrasives, diamond abrasives and chemical abrasives.
MCF glass testing blocks are mainly made of quartz glass and composite metal and are used in conjunction with our glass lapping plate, while custom glass testing blocks are available for PM5, PM6 and LP70 machines users.
MCF glass lapping plate is mainly made of quartz glass and composite metal, suitable for our precision lapping equipment, and we can also provide custom glass lapping plate for PM5, PM6, LP70 and other equipment.
As an important part of the MCF drive ring, we use a high strength corrosion resistant material that is easy to replace, greatly extending the overall jig life and reducing the cost of using the jig.
MCF has a wide variety of colloidal silica, which can provide conventional colloidal silica polishing fluid according to different materials and process requirements of users, and can also provide professional chemical polishing fluid for special materials requiring.
MCF wax remover is extracted from plants, which is more environmentally friendly, non-toxic and harmless to human body. It is an efficient wax removal cleaning product. It has the characteristics of fast and thorough wax removal and good water washing performance.
MCF bonding wax is mainly divided into low temperature bonding wax and high temperature bonding wax, with stable quality, no impurities, high bonding precision, good fixing effect, uniform waxing, easy cleaning, high temperature bonding wax viscosity, strong bonding.
MCF wax-free adhesive film is suitable for fixing samples of semiconductor materials and photoelectric materials before polishing. Such as: silicon wafer, sapphire, ceramic wafer, GaAs, InP, CZT, MCT and other conventional samples or special-shaped sample materials with high precision grinding, polishing and other processes.
MCF float glass substrates are manufactured from high quality, optical grade fused silica. The substrate is 3 inch TTV less than or equal to 1μm, 4 inch TTV less than or equal to 2μm, 6 inch TTV less than or equal to 3μm.
MCF grinding powder/polishing powder include: alumina powder, silicon carbide powder, boron carbide powder, cerium oxide powder and so on. The grinding liquid/polishing liquid can be proportioned according to the requirements of the user's material and process, or it can be adjusted according to the process requirements and materials by itself.
MCF diamond slurry mainly consists of single crystal diamond slurry and polycrystal diamond slurry through high precision matching, which is mainly used in semiconductor industry and photoelectric industry. According to different process requirements, single crystal diamond slurry or polycrystal diamond slurry with different particle size and ratio is selected.
MCF precision grinding polishing pad, it is good abrasive storage, economic and durable, different materials, different particle sizes, mainly suitable for semiconductor industry and photoelectric industry precision grinding polishing processing. The high accuracy below nanometer level is excellent.
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