The MCF precision jig is suitable for lapping and polishing semiconductor and photovoltaic materials. The jig is made of high strength corrosion resistant material and is suitable for use with chemical polishing fluid.
Functional Feature Description
Technical Application
• The wafer samples are absorbed on the bottom surface of the jig by vacuuming, and can be customized according to the user process requirements of various angle and other non-standard jig accessories, to achieve the polishing of non-standard shape sample and angle.
• The jig is equipped with Bluetooth optional function, which can monitor the removal amount of samples online, with an accuracy of 1um, and automatically stop the machine when reaching the preset removal amount.
• The load is variable from 0-10kg on the heaviest jigs. Counterweight blocks of different weights can be customized.