Bluetooth connection jig

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Bluetooth connection jig

MCF precision jig is suitable for lapping and polishing of semiconductor materials and photoelectric materials. The jig adopts high-strength corrosion-resistant materials, automatic connection of Bluetooth transmission and real-time online monitoring.

Functional Feature Description

Technical Application

• The wafer samples are absorbed on the bottom surface of the jig by vacuuming, and can be customized according to the user process requirements of various angle and other non-standard jig accessories, to achieve the polishing of non-standard shape sample and angle.
• The jig is equipped with Bluetooth function, which can monitor the removal amount of samples online, with an accuracy of 1um, and automatically stop when the removal amount is reached in advance.
• The load is variable from 0-10kg on the heaviest jigs. Counterweight blocks of different weights can be customized.

Applicable materials include:
• Silicon-based materials (Si, a-Si, poly Si)
• III-V materials (GaAs, InP, GaSb, etc.)
• Third generation semiconductor materials (SiC, GaN, etc.)
• Infrared materials (CZT, MCT, etc.)
• Photoelectric materials (LiNbO₃, LiTaO₃, SiO₂, etc.)
• Metallic materials (Au, Cu, Al, Mo, TC4, etc.)
The scope of application includes:
• MEMS
• Semiconductor devices
• Semiconductor substrate
• Encapsulation

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Bluetooth connection jig

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