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Optical Fiber End Jig

MCF precision jig is suitable for lapping and polishing of semiconductor materials and photoelectric materials. The jig is made of high-strength corrosion-resistant material, which is suitable for polishing optical fiber end face or crystal end face.

  • Functional Feature Description
  • Technical Application
    • • The wafer samples are absorbed on the bottom surface of the jig by vacuuming, and can be customized according to the user process requirements of various angle and other non-standard jig accessories, to achieve the polishing of non-standard shape sample and angle.
       
    • • The jig is equipped with Bluetooth function, which can monitor the removal amount of samples online, with an accuracy of 1um, and automatically stop when the removal amount is reached in advance.
    • • The load is variable from 0-3.5kg on the heaviest jigs.
    • Applicable materials include:
      • Silicon-based materials (Si, a-Si, poly Si)
      • III-V materials (GaAs, InP, GaSb, etc.)
      • Third generation semiconductor materials (SiC, GaN, etc.)
      • Infrared materials (CZT, MCT, etc.)
      • Photoelectric materials (LiNbO₃, LiTaO₃, SiO₂, etc.)
      • Metallic materials (Au, Cu, Al, Mo, TC4, etc.)
    • The scope of application includes:
      • MEMS
      • Semiconductor devices
      • Semiconductor substrate
      • Encapsulation

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