• The loading gauge can accurately measure the wafer back pressure value, and can accept up to 10 kg of sample pressure load. Digital display for easy operation. Ensure repeatability and consistency of process.

• The measuring accuracy of the loading gauge is 2g/c㎡, which is beneficial for III-V materials or ultra-thin and fragile materials, where the pressure is precisely controlled during the lapping and polishing process.

• Applicable to SH series jig, can be customized according to user requirements of loading gauge.

Applicable materials include:
• Silicon-based materials (Si, a-Si, poly Si)
• III-V materials (GaAs, InP, GaSb, etc.)
• Third generation semiconductor materials (SiC, GaN, etc.)
• Infrared materials (CZT, MCT, etc.)
• Photoelectric materials (LiNbO₃, LiTaO₃, SiO₂, etc.)
• Metallic materials (Au, Cu, Al, Mo, TC4, etc.)

The scope of application includes:
• MEMS
• Semiconductor devices
• Semiconductor substrate
• Encapsulation