MCF wax-free adhesive films are suitable for use in the bonding process of semiconductor and photoelectric materials during lapping and polishing processes, and can be selected from low temperature wax-free adhesive film or high temperature wax-free adhesive film depending on the sample bonding requirements. After the sample has been processed, the wax-free adhesive film can come off by itself by heating the sample with wax-free adhesive film, without causing secondary contamination or damage to the sample.