MCF polishing pad is mainly suitable for lapping and polishing processing of materials in semiconductor industry and photoelectric industry, such as PZT, GaAs, InP, glass hard disk, optical glass, metal products, sapphire wafer, silicon carbide wafer, silicon carbide and other materials or workpiece precision lapping and polishing processing. For the workpiece of different materials and sizes, can choose different sizes and shapes to make polishing pads such as checked spun antung, rice pattern and thread grooves.