Based on years of experience in MEMS processing and advanced lapping and polishing equipment, MCF provides various MEMS wafer CMP, lapping and polishing process solutions.

With proven technology for the preparation of semiconductor materials, MCF offers equipment and process solutions for lapping, polishing and bonding waxes for a wide range of semiconductor devices.

With proven technology for the preparation of semiconductor materials, MCF offers equipment and process solutions for lapping, polishing and bonding waxes for a wide range of semiconductor devices.

MCF, with its rich experience in advanced packaging technology and advanced lapping and polishing equipment, can provide process solutions such as TSV, SIP, FlipChip, Bumping and EMC.