Mature wafer substrate material preparation technology, substrate surface treatment by precision lapping and polishing equipment, to achieve high quality homogeneous epitaxy.
The substrate material on the back side of a completed wafer is thinned to remove a certain thickness to achieve a surface roughness of nanometer to atomic level.
Flattening of wafer metal surfaces and polymer heterogeneous structures during processing using chemical corrosion and mechanical forces.
Dedicated to the development and manufacture of high precision lapping and polishing equipment for semiconductor and crystal materials, as well as related processes.
Range of application
Obtained ISO quality management system certification.
Global supply, provide a variety of transportation, quick and fast.
Chinese and British expert technical team to provide global professional services.
Provide the world's leading lapping technology, exclusive custom service.
Covering semiconductor, photoelectric field of a variety of materials.
7 x 24 hours to provide you with no worry guarantee.
September 6 - September 8, 2023, Shenzhen International Convention and Exhibition Center Hall 8. MCF welcomes you and looks forward to your arrival.2023-09-04 More
MCF was invited to China Optics Valley Jiufengshan Forum and Compound Semiconductor Industry Development Conference2023-04-18 More
MCF has established a united laboratory with the School of Information Science and Technology at Peking University to develop and innovate lapping and polishing processes for semiconductor materials.2022-12-21 More
The MCF product range is unique and technologically advanced in the field of grinding and polishing, applying the industry's most advanced technology to the grinding, polishing and chemical mechanical polishing (CMP) of semiconductor materials.2022-12-21 More
MCF won the tender for the procurement of lapping machines for the China Air-borne Missile Academy on the basis of its technical excellence and service capabilities.2022-12-21 More