Email Address:

info@mcfsens.com

Call Telephone:

400-6988-696

Bonding Unit

  • WBS400S
  • WBS400S Wafer Substrate Bonding Unit

    WBS400S series semi-automatic adhesive machine is a tool developed by MCF company for high precision semiconductor wafer sample wafer and substrate wafer bonding process, equipped with pressure bonding module. Easy to operate, high quality to achieve bonding process.

  • WBS600
  • WBS600 Wafer Substrate Bonding Unit

    The WBS series of wafer substrate bonding equipment is developed by MCF Company for high-precision semiconductor wafer sample and float glass substrate bonding process, complete automatic bonding operation, equipped with vacuum and pressure bonding units. Easy to operate, high quality to achieve bonding process.

  • WBS400
  • WBS400 Wafer Substrate Bonding Unit

    The WBS series of wafer substrate bonding equipment is developed by MCF Company for high-precision semiconductor wafer sample and float glass substrate bonding process, complete automatic bonding operation, equipped with vacuum and pressure bonding units. Easy to operate, high quality to achieve bonding process.

  • WBS300
  • WBS300 Wafer Substrate Bonding Unit

    The WBS series of wafer substrate bonding equipment is developed by MCF Company for high-precision semiconductor wafer sample and float glass substrate bonding process, complete automatic bonding operation, equipped with vacuum and pressure bonding units. Easy to operate, high quality to achieve bonding process.

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