Email Address：
info@mcfsens.com
info@mcfsens.com
400-6988-696
The AWS series of wafer substrate bonding equipment is developed by MCF Company for high-precision semiconductor wafer sample and float glass substrate bonding process, complete automatic bonding operation, equipped with vacuum and pressure bonding units. Easy to operate, high quality to achieve bonding process.
The AMS series of wafer substrate bonding equipment is developed by MCF Company for high-precision semiconductor wafer sample and float glass substrate bonding process, complete automatic bonding operation, equipped with vacuum and pressure bonding units. Easy to operate, high quality to achieve bonding process.
The AMS series of wafer substrate bonding equipment is developed by MCF Company for high-precision semiconductor wafer sample and float glass substrate bonding process, complete automatic bonding operation, equipped with vacuum and pressure bonding units. Easy to operate, high quality to achieve bonding process.
AMS-400S series semi-automatic adhesive machine is a tool developed by MCF company for high precision semiconductor wafer sample wafer and substrate wafer bonding process, equipped with pressure bonding module. Easy to operate, high quality to achieve bonding process.
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