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HOME > Product > L&P Machine > GNAD-E Series > GNAD-E Series Precision Lapping & Polishing Machine

GNAD-E Series Precision Lapping & Polishing Machine

Precision lapping and polishing system has scientific design, advanced performance, high degree of automation, easy operation, reliability and strong maintenance.
• Anti-corrosion, independent movable touch control system
• Multi-channel feed system
• Digital thickness monitoring device to monitor removal in real time
• Process parameter storage and timing function
• Equipped with interface reserved for working upgrades

  • Functional Feature Description
  • Technical Application
  • Equipment Parameter
    • • GNAD-E series precision polishing system has independent control system, and the whole machine anti-corrosion.
      • All parameters of the host machine can be set on the touch control system, and be controlled wirelessly or wired.
      • The jig is equipped with digital thickness monitoring device and an independent drive system, the swing speed and amplitude can be adjusted.
    • • The wafer samples are absorbed on the bottom surface of the jig by vacuuming, and can be customized according to the user process requirements of various angle and other non-standard jig accessories, to achieve the polishing of non-standard shape sample and angle.
      • The rotation speed of the lapping and polishing plate can be adjusted, and the replacement is convenient, greatly shortening the process time.
      • In the multi-channel feeding system, the Abrasive Autofeed Cylinder has the function of online stirring when working, and the drop rate can be accurately controlled.
    • • Polishing plate has online real-time temperature control and cooling optional function, when close to the preset temperature warning value, the equipment will automatically start the cooling function, to keep the polishing plate operating within the temperature range required by the process.
      • Polishing plate automatic washing optional function, can be real-time online washing polishing work area. And flow rate, cleaning time and other parameters can be precise numerical control.
      • Device timing function, preset time 0-10 hours. When the preset time is reached, the device will stop automatically.
    • Applicable materials include:
      • Silicon-based materials (Si, a-Si, poly Si)
      • III-V materials (GaAs, InP, GaSb, etc.)
      • Third generation semiconductor materials (SiC, GaN, etc.)
      • Infrared materials (CZT, MCT, etc.)
      • Photoelectric materials (LiNbO₃, LiTaO₃, SiO₂, etc.)
      • Metallic materials (Au, Cu, Al, Mo, TC4, etc.)
    • The scope of application includes:
      • MEMS
      • Semiconductor devices
      • Semiconductor substrate
      • Encapsulation
    Project Parameter
    Power supply: 220-240v 10A
    110v 10A
    50-60HZ
    Ambient temperature: 20°C ± 5°C
    Ambient humidity: < 80%
    Wafer size: 4” x 1/2/3
    6” x 1/2
    8” x 1
    Working plate diameter: 300mm / 420mm/550mm
    Driven jig rotation: 0-100rpm / 0-120rpm
    Plate speed: 0-100rpm / 0-120rpm/0-200rpm
    Timing: 0-10 hours
    Feed channel: ≥ 2

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