WBS400S Wafer Substrate Bonding Unit

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WBS400S Wafer Substrate Bonding Unit

WBS400S series semi-automatic adhesive machine is a tool developed by MCF company for high precision semiconductor wafer sample wafer and substrate wafer bonding process, equipped with pressure bonding module. Easy to operate, high quality to achieve bonding process.

Functional Feature Description

Technical Application

Equipment Parameter

● Independent work table, anticorrosive and durable.
● Equipped with pressure bonding module.
● One or two workstations, suitable for wafer bonding operation of 300mm and below.
● Provide stable and consistent bonding thickness and good dimensional accuracy.
● Ensure sample stability and consistency.
● The whole bonding process is about 10-20 minutes to complete (the process time is related to materials, different materials bonding wax and other factors).
● Can be used directly with the heating table.

Applicable materials include:
• Silicon-based materials (Si, a-Si, poly Si)
• III-V materials (GaAs, InP, GaSb, etc.)
• Third generation semiconductor materials (SiC, GaN, etc.)
• Infrared materials (CZT, MCT, etc.)
• Photoelectric materials (LiNbO₃, LiTaO₃, SiO₂, etc.)
• Metallic materials (Au, Cu, Al, Mo, TC4, etc.)
The scope of application includes:
• MEMS
• Semiconductor devices
• Semiconductor substrate
• Encapsulation

Project	Parameter
Power supply:	220-240v 10A 110v 10A 50-60HZ
Ambient temperature:	20℃±5℃
Ambient humidity:	< 80%
Wafer size:	4”x 1/2 6”x 1/2 8”x 1/2 12”x 1/2

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WBS400S Wafer Substrate Bonding Unit

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