Large Size Jig

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Large Size Jig

MCF precision jig is suitable for lapping and polishing of semiconductor materials and photoelectric materials. The jig is made of high-strength corrosion-resistant material, which can be used for chemical polishing liquid.

Functional Feature Description

Technical Application

• The wafer samples are absorbed on the bottom surface of the jig by vacuuming, and can be customized according to the user process requirements of various angle and other non-standard jig accessories, to achieve the polishing of non-standard shape sample and angle.
• The jig is equipped with Bluetooth optional function, which can monitor the removal amount of samples online, with an accuracy of 1um, and automatically stop the machine when reaching the preset removal amount.
• The load is variable from 0-10kg on the heaviest jigs. Counterweight blocks of different weights can be customized.
• Fixed size samples up to 8 inches.

Applicable materials include:
• Silicon-based materials (Si, a-Si, poly Si)
• III-V materials (GaAs, InP, GaSb, etc.)
• Third generation semiconductor materials (SiC, GaN, etc.)
• Infrared materials (CZT, MCT, etc.)
• Photoelectric materials (LiNbO₃, LiTaO₃, SiO₂, etc.)
• Metallic materials (Au, Cu, Al, Mo, TC4, etc.)
The scope of application includes:
• MEMS
• Semiconductor devices
• Semiconductor substrate
• Encapsulation

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Large Size Jig

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