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HOME > Product > Testing Equipment > Non-contact Gauging System > Non-contact Gauging System

Non-contact Gauging System

The " cushion of air " type non-contact measurement can avoid the surface damage caused by contact measurement. It is especially suitable for the measurement of soft and brittle materials and samples with high surface quality requirements. It is an ideal measuring instrument for semiconductor, optical and photoelectric materials.

  • Functional Feature Description
  • Technical Application
    • • The " cushion of air " type non-contact measurement, measuring accuracy can achieve 1 micron, simple operation of the instrument, stable performance.
      • The gauging system equipped with the thickness meter blows compressed nitrogen vertically down to the surface of the sample to be measured, forming a stable gas film on the surface of the sample. The thickness can be measured without touching the surface of the sample, and the thickness value of the sample can be displayed through a digital display system.
      • Fast response, high precision, not affected by the material of the measured target.
       
    • • Measuring arm with fine adjustment
      • Measuring range : ±1.25mm
      • Thickness range : 0 to 500 mm (or range can be set on request)
      • Sample size : 8 inches and below
      • Linearity: 0.25%
      • Digital display: 4.5 digit LED Units - Microns
       
    • • Reading accuracy: 0.1um
      • Measurement accuracy: 1um
      • Air source pressure: 2bar
      • Gas flow: 0.2cfm, adjustable by built-in pressure gauge.
      • Wafer supply: Clean meter air or nitrogen
      • Probe resolution: 2.5um
      • Repeatability: ±1um
      • Air gap: 75um(approx.)
      • Granite Base Size: 300x210x60mm (custom-made)
       
    • Applicable materials include:
      • Silicon-based materials (Si, a-Si, poly Si)
      • III-V materials (GaAs, InP, GaSb, etc.)
      • Third generation semiconductor materials (SiC, GaN, etc.)
      • Infrared materials (CZT, MCT, etc.)
      • Photoelectric materials (LiNbO₃, LiTaO₃, SiO₂, etc.)
      • Metallic materials (Au, Cu, Al, Mo, TC4, etc.)
    • The scope of application includes:
      • MEMS
      • Semiconductor devices
      • Semiconductor substrate
      • Encapsulation

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