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MCF and Peking University establish united laboratory

MCF's precision lapping and polishing equipment was procured by Peking University through a single source approach. The equipment is budgeted for the "National Integrated Circuit Industry and Education Innovation Platform", which focuses on meeting the construction needs of high-end industrial personnel courses and other platform construction, as well as expanding the chip process level of the Industry and Education Innovation Platform and enhancing the comprehensive supporting capacity.

MCF has a professional technical research and development team, based on years of rich processing experience, with advanced lapping and polishing equipment, to provide all kinds of MEMS wafers, semiconductor devices, semiconductor substrates, packaging and other CMP, lapping and polishing process solutions.

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