Four oversized polishing heads allow up to 48 2-inch or 4 * 8-inch samples to be polished simultaneously. Therefore, the MP series machines are ideal for use in full load production environments.

The automatic control panel of the MP series machine adopts a portable touch screen control, and the process parameters can be freely inputted and changed.

The automatic control and intelligent loading/unloading system can quickly polish chips to reach the epitaxial preparation surface. This system is particularly useful for handling hard substrate materials, and it can also operate chips up to 8 inches in size.


Technical parameters of four station grinding equipment

Number of fixtures: 4 workstations
Power supply: 220Vac 50Hz
Total power: 3.5 KW
Plate diameter: 760 mm
Disk speed: maximum 120 rpm
Jig swing angle: maximum 10 degrees
Up and down lifting distance: 100mm
Fixture speed: maximum 80 rpm
Fixture size: maximum 208 mm
Wafer fixation method: vacuum adsorption
Fixture vacuum branch: up to 4 channels
Clamp down pressure: 50 Kg
Drum: 4
Peristaltic pumps: 4
Display screen: 12.1-inch
Demand air pressure: greater than 7 bar
Vacuum: Required
Pure water: required
Cleaning water gun: Yes
Cleaning air gun: Yes
Door opening method: front and rear door opening
Door panel on countertop: fully transparent
Air outlet: None
Lighting: None
External dimensions: length x width x height
Total weight: Kg