In today's era of rapid technological advancement, the precision processing of semiconductors and related materials is critical to the progress of many high-tech industries. Beijing MC Semiconductor Technology Co., Ltd., with its superior technology, high-quality products, and comprehensive services, has earned widespread acclaim within the industry.

From a product perspective, MC’s precision lapping and polishing equipment is regarded as a benchmark in the industry. Take the GNAD-E series precision lapping and polishing system as an example — its application range is extensive, covering semiconductor materials, optoelectronic materials, and more. Whether it’s for common semiconductor materials like silicon, SiC, GaN, or special materials like quartz, GaSb, and InP, for thinning, backside, surface, or edge chemical mechanical polishing, this equipment handles it all with precision.

The main unit and all spare parts can be configured with fully anti-corrosion or non-corrosion materials, and it supports both wired and wireless (Bluetooth) connections to the control system, greatly enhancing its adaptability.

An independent oil-free vacuum pump and anti-backflow system effectively reduce contamination in ultra-clean environments, providing a reliable foundation for high-precision processing.

The touchscreen control panel is thoughtfully designed; all functional parameters can be easily set, and the panel is positioned outside the working area with a movable design. This avoids corrosion from slurry splashes while accommodating different operator habits. Samples are vacuum-adsorbed onto the fixture base, and non-standard fixture accessories with various angles can be customized per user process requirements, enabling polishing of non-standard shaped samples and angle-specific polishing.

The fixture is equipped with a digital thickness monitor, capable of tracking material removal in real-time with 1 μm precision during the lapping process. The fixture applies adjustable pressure on the wafer, within a range of 0–5000g, and is equipped with a pressure measurement device with a precision of 2g/cm², ensuring both high precision and process stability.