GAND-P Lapping and Polishing System
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High machining accuracy，with TTV≤2 um and RA ≤0.1 nm
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Suitable for processing of various special-shaped wafers below 6 inches
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Equipped with a cleaning tank and a flushing device to integrate lapping and polishing
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Pressure accuracy of the fixture reaching 2g/cm² and customizable pressurization module
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Optional bluetooth monitoring and Zion repair disc
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Editable to store at least 100 processes
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Capable of temperature control， such as tray temperature monitoring and automatic cooling
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