Single-Station Automatic Mafer Bonding Machine
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Applicable to process wafers and special-shaped wafers of 12 inches and below
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A wax chamber upgraded with anti-coagulant wax function
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Capable of automatic lamination and results display
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Temperature control based on dual temperature zones to control the temperature independently
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With a maximum process temperature of 200°C and an airbag made of high-temperature resistant materials
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Balloon-typed soft pressurization，wafer protection，bubble-free sticking wafer
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Real-time monitoring of temperature，pressure，and vacuum changes
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Multiple stations working independently at the same time to improve the efficiency of gluing sheets
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