CPI Chemical Lapping and Polishing System
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Suitable for pure chemical polishing of wafers of various sizes such as 2 inches，3 inches，4 inches，6 inches，and 8 inches
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The fixture can be optionally matched with different weight weights，which makes it suitable for the polishing needs of different materials
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Post-polishing roughness change value ΔRa≤±2nm
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Customizable splints，fixtures，eccentricities，etc.
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A small body for easy disassembly and assembly
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Equipped with a remote operating system
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Virtually zero mechanical force to avoid orange peel and scratch effects
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Advanced anti-corrosion materials and structural design adopted to make the machine wholly corrosion-resistant
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