Batch Lapping and Polishing System
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High machining accuracy with TTV: ≤±1 um and RA ≤0.1 nm
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Suitable for processing of various special-shaped wafers below 8 inches
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Simultaneous processing at the station can polish up to 48 2-inch wafers at a time with high output
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Polishing time reduced by 70% with 0-50Kg load per polishing head
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The equipment is capable of monitoring the surface shape of the lapping and polishing disc in real-time online and applicable to trim the surface shape of the lapping and polishing disc online in real time，with the accuracy of disc shape control reachimg 1u
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Easy to move as the whole system is placed with universal wheels with locking function，which is convenient for fixing and moving
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Convenient in operation and maintenance，simple automatic panel control，all parameter settings are operated on the panel，simple and clear. Also equipped with an intelligent loading/unloading system for easy operation
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Capable of temperature control，such as tray temperature monitoring and automatic cooling
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Versatility and diversity; applicable to polish a variety of materials，ensure higher efficiency and productivity for high-precision polishing，and support the production of different polishing templates according to the exact requirements of users for the best results
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