In the highly competitive field of wafer lapping and polishing, Beijing MC's precision equipment has consistently maintained a leading position. The GNAD-E series precision lapping and polishing system, for example, boasts impressive capabilities. Widely applied in the processing of semiconductor and optoelectronic materials, it can perform high-precision thinning and CMP on wafers made of silicon, SiC, GaN, quartz, GaSb, InP, and more.

The equipment’s main unit and spare parts can be configured with fully anti-corrosion or non-corrosion materials, connected to the control system via wired or wireless (Bluetooth) communication, significantly improving flexibility and adaptability. The machine is equipped with an independent oil-free vacuum pump and anti-backflow function, effectively minimizing contamination in cleanroom environments, ensuring optimal conditions for high-precision wafer processing.

Its touchscreen control panel is ergonomically designed for user convenience, positioned outside the working area, movable, and splash-proof, ensuring both durability and user-friendly operation. All parameters are clear and easy to set.

Sample fixation is achieved through vacuum adsorption at the fixture base. Non-standard fixture accessories with customized angles can be tailored to meet specific process requirements, allowing polishing of non-standard shaped wafers and precise angle polishing. The fixture’s digital thickness monitor can track material removal during the process with 1 μm accuracy. The fixture applies continuously adjustable pressure ranging from 0 to 5000g, equipped with a pressure measurement system with a precision of 2g/cm², ensuring every wafer is processed with pinpoint accuracy, significantly enhancing product quality and yield.