In the critical stages of wafer manufacturing, the precision and efficiency of the polishing process directly determine the final product’s quality and production capacity. Beijing MC’s wafer polishing equipment, with its professional technology, outstanding performance, and wide applicability, has become a leader in the industry, injecting strong momentum into wafer processing.

The GNAD-E series precision lapping and polishing system, in particular, delivers exceptional polishing performance. Whether it’s common semiconductor wafers like silicon and SiC, or special materials like quartz and InP, it can perform high-precision CMP processes with ease. The machine’s main unit and components can be customized with fully anti-corrosion or non-corrosion materials to suit different processing environments.

An independent oil-free vacuum pump and anti-backflow design effectively eliminate contamination risks in ultra-clean environments, creating an ideal polishing environment for wafers. The touchscreen control panel is user-centric, positioned outside the working area, movable, and designed to prevent corrosion from slurry splashes. It allows operators to easily adjust parameters based on their preferences, with all functions clearly displayed for efficient and intuitive operation.