棒状粘接蜡
MCF 品牌粘接蜡主要分为高温粘接蜡和低温粘接蜡。
-
熔点温度区间在60℃-200℃之间
-
品质稳定、易清洗、易下蜡
-
可用于高精度切削、研磨、抛光等工艺制程
-
采用环保热熔粘接剂技术
- HOME
-
Lap&Pol
-
GAND-E Lapping and Polishing System
The basic model is integrated with lapping and polishingSize：85*75*55cm -
GAND-T Lapping and Polishing System
Fully Enclosed Lapping and Polishing SystemSize：100*70*110cm -
GAND-P Lapping and Polishing System
Integrated lapping & polishing and cleaningSize：147*70*165cm -
CPI Chemical Lapping and Polishing System
Atomic-scale Surface PolishingSize：55*53*77mm -
Batch Lapping and Polishing System
Processes 48 × 2” wafersMulti-motor Drive System -
High Precision Double-Sided Lapping
The polishing slurry can be recycledHigh-precision surface profile control
-
-
CMP&Clean
-
CDP-400 Manual
可加工4寸及以下Size：90*65*150cm -
CDP-600 Manual
可加工6寸及以下尺寸：90*65*150cm -
ACDP-600 Manual
It can process 6 inches and belowSize：86*72*180cm -
CDP-800 Semi-Auto
可加工8寸及以下Size：110*145*220cm -
CDP-800 Fully Auto
带机械手臂运输尺寸：210*145*220cm -
Wafer Cleaning
Choice of various cleaning mediaBiphase cleaning and combined drying system
-
-
Bonding
-
Microscope
-
Solution
-
About Us
marketing@mcfsens.com
Whats
Whats
Please Leave Us a Message on the Right