Wafer Cleaning
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The two-fluid cleaning technology applied to build the nano-scale two-fluid cleaning structure，with the DIW and N₂ flow rates adjustable according to the process requirements
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The intelligent process control system integrates PLC+PC control，manual and automatic switching，allowing the quality of the brushed wafer to be recorded
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Powerful data storage function，allowing machine LOG information to be stored and retained for 6 months; process recip can be edited and stored at least 100 pieces
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Dry-and-wet separation，a composite drying system that uses spin drying and lamp drying composite method to dry wafers
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Continuous transfer of 1，000 pieces without failure，with the processing breakage rate being less than 1/5000
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The machine inspection can observe the full path of the wafer
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Any part of the machine needs to be easily disassembled for later maintenance
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Equipped with wafer and cassette correct position detection and alarm system
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