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高精密CMP设备
高精密CMP设备引领超光滑表面加工新潮流
In the field of optical material research and development, chemical mechanical polishing is equipped with lapping and polishing machines（CMP）Technology is redefining the processing limits of translucent optical glass。针对石英、氟化钙等脆性材料在医疗内窥镜、高精度检测仪器及纳米级光学镜头中的严苛需求，CMP通过精密调控纳米磨料与反应试剂的协同作用，实现表面粗...
激光测距
纯化学抛光设备开创红外探测器原子级加工先河
In the field of infrared detector manufacturing,Pure chemical polishing machine is reshaping the manufacturing paradigm of high-precision optical components.面对碲镉汞、锑化铟等脆性红外材料的原子级加工需求，纯化学抛光通过精准控制腐蚀液配比与反应动力学，在无机械应力条件下实现0.05nm表面粗糙度的突破。相较于传统研磨抛光机，该技术对硫...
节能光源
制造节能光源的利器：lapping and polishing machines
In the wave of transformation of the energy-saving light source industry to high brightness and low energy consumption, lapping and polishing machines have become the core tools for the manufacture of LED, OLED and quantum dot light-emitting materials.。针对Alq3、PPV等有机光电材料对纳米级表面平整度的严苛需求，高精度研磨抛光机通过多轴联动控制与纳米级磨粒配比技术，实现了发光层厚度误差...
晶圆制造
CMP（化学机械抛光）技术：晶圆全局平坦化的终极解决方案
In the process of semiconductor manufacturing moving towards the 3nm process, the lapping and polishing machine is mountedCMP (Chemical Mechanical Polishing)technology has become the ultimate solution to achieve global wafer flattening。针对硅片、覆铜硅基以及金半混合表面在多层堆叠中产生的微米级起伏，高精度CMP设备通过纳米磨料配方与分区加压的协同作用，将表面粗...
光通讯
The lapping and polishing machine has made outstanding contributions in the field of optical communication
In today's rapid development of the optical communication industry, the lapping and polishing machine, as the core equipment of precision manufacturing, provides key process support for the processing of III.-V semiconductor materials such as gallium arsenide and indium phosphide and lithium niobate modulators。针对光芯片对亚微米级表面粗糙度与纳米级平面度的严苛要求，高精度研磨抛光机通过多级压力调控与平面度控制系统...
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