Batch Lapping and Polishing System
-
High machining accuracy with TTV: ≤±1 um and RA ≤0.1 nm
-
Suitable for processing of various special-shaped wafers below 8 inches
-
Simultaneous processing at the station can polish up to 48 2-inch wafers at a time with high output
-
Polishing time reduced by 70% with 0-50Kg load per polishing head
-
The equipment is capable of monitoring the surface shape of the lapping and polishing disc in real-time online and applicable to trim the surface shape of the lapping and polishing disc online in real time，with the accuracy of disc shape control reachimg 1u
-
Easy to move as the whole system is placed with universal wheels with locking function，which is convenient for fixing and moving
-
Convenient in operation and maintenance，simple automatic panel control，all parameter settings are operated on the panel，simple and clear. Also equipped with an intelligent loading/unloading system for easy operation
-
Capable of temperature control，such as tray temperature monitoring and automatic cooling
-
Versatility and diversity; applicable to polish a variety of materials，ensure higher efficiency and productivity for high-precision polishing，and support the production of different polishing templates according to the exact requirements of users for the best results
Have a Question? Leave Us a Message on the Right