Batch Lapping and Polishing System
-
高加工精度TTV：≤±1 um，RA：≤0.1 nm
-
适用8寸以下及各类异形晶圆加工
-
工位同时加工，高产量一次最多可抛光48片2英寸晶片
-
减少抛光时间 ，每个抛光头0-50Kg负载 ，抛光时间可减少70%
-
The equipment has the function of real-time online monitoring of the surface shape of the lapping and polishing disc in the process of the process，and can trim the surface shape of the lapping and polishing disc online in real time. The accuracy of disc shape control is 1um
-
易于移动 ，整个系统安放使用带锁定功能的万向轮 ，方便固定和移动
-
操作和维护方便、简单自动化面板控制 ，全部参数设置都在面板上操作 ，简单、明了。另装有智能 的装载/卸载系统 ，容易操作
-
具备盘温监控、自动冷却等温度控制功能
-
Versatility and diversity，it can polish a variety of materials，enough to provide higher efficiency and productivity for high-precision polishing，and can make different polishing templates according to the exact requirements of users to achieve the best results
Have a Question? Leave Us a Message on the Right