GAND-T Lapping and Polishing System

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首页 / Lap&Pol / 产品详情-GAND-T Lapping and Polishing System

GAND-T Lapping and Polishing System

加工精度高，TTV≤2 um，RA：≤0.1 nm
适用6寸以下及各类异形晶圆加工
具备盘型蓝牙监控并自动修复功能
夹具压力精度达到2g/cm²，可订制加压模块
封闭式工作区，可适应高净化等级环境
可编辑可存储至少100条工艺程序
具备盘温监控、自动冷却等温度控制功能
配备水枪、气枪等冲洗系统，高效清洁

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