Infrared Interference Microscope IS2000
The precision lapping and polishing system is scientifically designed, advanced and automatic
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A scientifically designed，advanced and automatic precision lapping and polishing system
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Multiple configurable measurement modes: 5 points，49 points，meter line，pulse line
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Strong measuring adaptability: rough surface，polished surface，graphic surface
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Measurable wafers: 12-inch wafers and below
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Comprehensive measuring capabilities to meet wafer geometry metrology requirements at all stages of the semiconductor manufacturing process
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Support detailed data output and record management
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Modular integrated measurement suited to wafer warpage，thickness，microtopography，film thickness and other geometric parameters
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