Single-Station Automatic Mafer Bonding Machine
-
Applicable to process wafers and special-shaped wafers of 12 inches and below
-
A wax chamber upgraded with anti-coagulant wax function
-
Capable of automatic lamination and results display
-
Temperature control based on dual temperature zones to control the temperature independently
-
With a maximum process temperature of 200°C and an airbag made of high-temperature resistant materials
-
Balloon-typed soft pressurization，wafer protection，bubble-free sticking wafer
-
Real-time monitoring of temperature，pressure，and vacuum changes
-
Multiple stations working independently at the same time to improve the efficiency of gluing sheets
Have a Question? Leave Us a Message on the Right