CDP-400 Manual
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Industry-leading polishing roughness，speed，and consistency
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Capable of of accurate optical EPD endpoint detection
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At least 100 process menus can be edited and stored
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Capable of disc temperature monitoring，automatic cooling，and automatic flushing
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Applicable to process 2-6 inch and special-shaped wafers
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Adjustable polishing head pressure from 0.5 to 8 psi
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The polishing head supporting 3-zone pressure control
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Nanometer-level accuracy of removal
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