CDP-800 Fully Auto
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The polishing head allowing for 3 zone pressure control
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The full range of models enabling the processing of 2-8 inch and special-shaped wafers
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Nanometer accuracy of removal
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Industry-leading polishing roughness，speed，and consistency
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Capable of accurate optical EPD endpoint detection
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Polishing head pressure can be modulated up to 12psi
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At least 100 process menus can be edited and stored
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Applicable to disc temperature monitoring，automatic cooling，and automatic flushing
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