GAND-P Lapping and Polishing System
-
加工精度高，TTV≤2 um，RA：≤0.1 nm
-
适用6寸以下及各类异形晶圆加工
-
It is equipped with a cleaning tank and a flushing device to realize the integration of lapping and polishing
-
The pressure accuracy of the fixture reaches 2g/cm² and the pressurization module can be customized
-
Optional Bluetooth monitoring and Zion repair disc function
-
Editable to store at least 100 processes
-
It has temperature control functions such as tray temperature monitoring and automatic cooling
Have a Question? Leave Us a Message on the Right