GAND-P Lapping and Polishing System
-
High machining accuracy，with TTV≤2 um and RA ≤0.1 nm
-
Suitable for processing of various special-shaped wafers below 6 inches
-
Equipped with a cleaning tank and a flushing device to integrate lapping and polishing
-
Pressure accuracy of the fixture reaching 2g/cm² and customizable pressurization module
-
Optional bluetooth monitoring and Zion repair disc
-
Editable to store at least 100 processes
-
Capable of temperature control， such as tray temperature monitoring and automatic cooling
Have a Question? Leave Us a Message on the Right