键合膜
MCF bonding films are mainly divided into two sizes: high-temperature bonding film and low-temperature bonding film. It is suitable for special-shaped samples to bond and protect samples before lapping and polishing.
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MCF bonding film is suitable for semiconductor materials and optoelectronic materials in the lapping and polishing process of the bonding process，and the low-temperature bonding film or high-temperature bonding film can be selected according to the sample bonding requirements. After the sample processing is completed，the sample with the bonding film can be heated by heating，and the bonding film can fall off on its own， which will not cause secondary pollution and damage to the sample.
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