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首页 / Accessories & Consumables / 产品详情-压力测试规
压力测试规
The pressure gauge accurately measures the wafer back pressure and can accept sample pressure loads of up to 10 kg. Digital display, easy to operate. Ensure process repeatability and consistency. The measurement accuracy of the pressure test gauge is 2g/c㎡, and the pressure is precisely controlled in the lapping and polishing process.
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  • Lapping and Polishing Machine

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Beijing MCF Semiconductor Technology Co., Ltd
地址：北京市丰台区科学城星火路11号
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MCF Technologies Ltd., (Beijing)
京ICP备2023004120号-1