用于硅片、覆铜硅基表面、其它金半混合表面的全局平坦化中的关键CMP工艺
晶圆制造
相关产品
- HOME
-
Lap&Pol
-
GAND-E Lapping and Polishing System
The basic model is integrated with lapping and polishing尺寸：85*75*55mm -
GAND-T Lapping and Polishing System
Fully Enclosed Lapping and Polishing SystemSize：100*70*110mm -
GAND-P Lapping and Polishing System
Integrated lapping & polishing and cleaning独立控制单元 -
CPI Chemical Lapping and Polishing System
Atomic-scale Surface PolishingSize：55*53*77mm -
Batch Lapping and Polishing System
Processes 48 × 2” wafersMulti-motor Drive System -
High Precision Double-Sided Lapping
The polishing slurry can be recycledHigh-precision surface profile control
-
-
CMP&Clean
-
Bonding
-
Microscope
-
Solution
-
About us
marketing@mcfsens.com
Whats
Whats
Have a Question? Leave Us a Message on the Right