用于夜视仪、红外制导、无人机监测、智能手机红外传感等红外探测领域的碲镉汞、锑化铟、硫化铅、锑化镓、钽酸锂等材料的制造过程
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Lap&Pol
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GAND-E Lapping and Polishing System
The basic model is integrated with lapping and polishingSize：85*75*55cm -
GAND-T Lapping and Polishing System
Fully Enclosed Lapping and Polishing SystemSize：100*70*110cm -
GAND-P Lapping and Polishing System
Integrated lapping & polishing and cleaningSize：147*70*165cm -
CPI Chemical Lapping and Polishing System
Atomic-scale Surface PolishingSize：55*53*77mm -
Batch Lapping and Polishing System
Processes 48 × 2” wafersMulti-motor Drive System -
High Precision Double-Sided Lapping
The polishing slurry can be recycledHigh-precision surface profile control
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CMP&Clean
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CDP-400 Manual
可加工4寸及以下Size：90*65*150cm -
CDP-600 Manual
可加工6寸及以下尺寸：90*65*150cm -
ACDP-600 Manual
It can process 6 inches and belowSize：86*72*180cm -
CDP-800 Semi-Auto
可加工8寸及以下Size：110*145*220cm -
CDP-800 Fully Auto
带机械手臂运输尺寸：210*145*220cm -
Wafer Cleaning
Choice of various cleaning mediaBiphase cleaning and combined drying system
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Bonding
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Microscope
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Solution
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About Us
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