MCF successfully won the bid for the "Fudan University Wafer Lapping Machine Procurement" project with its excellent products!

Fudan University has a world-class reputation, ranking between 30-60 in the global reputation, ranking third in Chinese mainland. The university is committed to continuously and stably contributing to the progress of civilization in the best state, actively implementing the 17 United Nations Sustainable Development Goals, ranking among the top universities in the world in terms of comprehensive influence on sustainable development, and has achieved outstanding achievements in the fields of SDG7 (affordable and clean energy) and SDG 8 (decent work and economic growth). Now a top academic research institution with world-class research laboratories and professors, it is the cradle of future scientists, engineers, entrepreneurs and industry leaders in the field of information science and technology.

MCF's R&D and manufacturing products have unique technological advancements in the field of lapping and polishing, and apply the industry's most cutting-edge technology to the lapping, polishing and chemical mechanical polishing (CMP) of semiconductor materials.