First, focus on the equipment’s performance and quality.    

The machine’s performance parameters directly affect processing results. It’s important to understand its precision, stability, and efficiency. 

For example, the GNAD-E precision lapping and polishing machine by Beijing MCF Semiconductor Technology Co., Ltd. is equipped with a 420 mm diameter lapping/polishing plate. Its robotic roller actively rotates for more uniform polishing and allows stepless adjustment of oscillation frequency to ensure surface flatness.

Durability is also critical. This can be assessed by looking into the manufacturer’s choice of materials, production processes, and whether strict quality inspection protocols are in place. Beijing MCF Semiconductor follows a “Flatter, Thinner, More Reliable” technical philosophy, emphasizing process stability and reliable equipment quality.