MCF and the School of Information Science and Technology of Peking University have jointly established a joint laboratory to jointly develop and innovate the lapping and polishing process of semiconductor materials.

Peking University procures MCF precision lapping and polishing equipment from a single source. The equipment is the budget equipment of the "National Integrated Circuit Industry-Education Integration Innovation Platform", which focuses on meeting the needs of platform construction such as high-end industrial talent course training, and at the same time expands the chip technology level of the industry-education integration innovation platform and improves the comprehensive supporting capacity.

MCF has a professional technical R&D team, based on years of rich processing experience, with advanced lapping and polishing equipment, to provide various MEMS wafers, semiconductor devices, semiconductor substrates, packaging and other CMP, lapping, polishing process solutions.