Beijing MCF Semiconductor Technology Co., Ltd. excels in GaAs wafer lapping and polishing equipment. The company is dedicated to R&D, production, and sales of ultra-precision surface processing equipment in the semiconductor field, with the mission of “Driving semiconductor advancement, supporting customer growth.”

MCF provides a full-process equipment and process solution for compound semiconductor substrates such as GaAs, covering thinning, lapping, polishing, temporary bonding, and cleaning. For instance, its double-sided and single-sided polishing machines, automatic wafer bonders, and wafer cleaning systems meet the requirements of different GaAs processing stages.

Beijing MCF Semiconductor leads with advanced technology and a “Flatter, Thinner, More Reliable” strategy, delivering industry-leading performance and process stability. The company holds numerous patents — for example, in 2023 it filed a utility patent for a wafer lapping and polishing machine. By innovating the fixture (lapping head) design for semiconductor sample processing, the pressure control during GaAs polishing is more precise. This significantly improves adjustment accuracy during processing, helping to ensure consistency and high quality.