To meet the diverse needs of different customer groups, Beijing MC (AIMX) has meticulously developed a comprehensive product line of lapping and polishing equipment. The company's product offerings include high-precision wafer lapping machines, double-sided lapping machines, chemical mechanical polishing (CMP) machines, and more. Each series is further subdivided into various models based on processing capacity, precision requirements, and sample sizes, providing customers with a wide range of choices.

In the semiconductor industry, MC's high-precision lapping and polishing equipment is capable of ultra-precision processing of semiconductor materials such as silicon, silicon carbide (SiC), silicon oxide, gallium arsenide (GaAs), and aluminum nitride (AlN), ensuring wafer surface flatness and roughness meet the highest standards. For certain materials, surface roughness (Ra) can reach 0.1 nm, and Total Thickness Variation (TTV) can be controlled within ±1 μm.

In the optics sector, our equipment is used for the lapping and polishing of optical lenses, prisms, and other optical components, significantly enhancing optical performance and imaging quality.

Additionally, in industries such as automotive manufacturing, aerospace, and medical devices, MC's lapping and polishing equipment plays a crucial role in helping enterprises improve product quality and strengthen market competitiveness.