MCF受邀中国光谷九峰山论坛暨化合物半导体产业发展大会
时间：4月19-21日
报告题目:抛光机台在大面积碲锌镉衬底抛光工艺中的应用
️演讲嘉宾:James McAneny
期待您的光临！
MCF受邀中国光谷九峰山论坛暨化合物半导体产业发展大会
2025-05-28
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Lap&Pol
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GAND-E Lapping and Polishing System
The basic model is integrated with lapping and polishing尺寸：85*75*55mm -
GAND-T Lapping and Polishing System
Fully Enclosed Lapping and Polishing SystemSize：100*70*110mm -
GAND-P Lapping and Polishing System
Integrated lapping & polishing and cleaning独立控制单元 -
CPI Chemical Lapping and Polishing System
Atomic-scale Surface PolishingSize：55*53*77mm -
Batch Lapping and Polishing System
Processes 48 × 2” wafersMulti-motor Drive System -
High Precision Double-Sided Lapping
The polishing slurry can be recycledHigh-precision surface profile control
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CMP&Clean
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Bonding
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Microscope
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Solution
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About us
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